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Expand from 10 to 18 rack SKUs across NVIDIA, AMD, and custom ASIC vendors, each with distinct training vs inference FLOPS, VRAM capacity, cooling requirements, and interconnect technology. Adds cooling hierarchy (air/liquid/immersion) that gates rack deployment, VRAM requirements that gate model training by generation, interconnect multipliers for distributed training scaling, and PUE-based energy cost reduction for advanced cooling. Includes save migration from v4 to v5, 6 new research nodes, and UI updates showing split compute stats. Co-Authored-By: Claude Opus 4.6 <noreply@anthropic.com>